This board Level application note for SOD-923 two pin diode package from ON SEMICONDUCTOR is prepared by Steve St. Germain. ON Semiconductor’s SOD-923 represents the latest in small surface mount two pin Diode package technology. Due to the small size of the package, it is important that the mounting process follow the suggested guidelines outlined in this document. This includes printed circuit board mounting pads, the soldermask and stencil pattern, and the assembly process parameters.
Application note’s content including the introduction, package overview, board mounting process, PCB solder pad design, PCB solderable metallization, solder mask, solder type, solder stencil screening, package placement, solder reflow, rework procedure, and more.
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